Detecting Thermal Interface Material (&#39;TIM&#39;) Between A Heat Sink And An Integrated Circuit

ABSTRACT

Detecting TIM between a heat sink and an integrated circuit, the heat sink including TIM detection points, each TIM detection point adapted to receive TIM upon installation of the heat sink, each TIM detection point including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; and determining, by a TIM detection module in dependence upon the activations of the TIM detection devices, sufficiency of the TIM between the heat sink and the integrated circuit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The field of the invention is data processing, or, more specifically,methods, apparatus, and products for detecting thermal interfacematerial (‘TIM’) between a heat sink and an integrated circuit

2. Description of Related Art

As the number of devices on a server or other computer requiring heatsinks increases, determining that each heat sink has sufficient thermalinterface material (TIM) becomes more important. Current techniquesrequire the user or manufacturer to tighten the heat sink down and thenremove the heat sink to ensure the thermal paste is uniform.Alternatively, an assumption is made that the TIM is sufficient withoutremoval of the heat sink or any further check. The current techniquesare manual, time consuming, and an often provide an inaccurateindication of the sufficiency of the TIM. A system that is powered onwith insufficient TIM can result in permanent damage to its circuitry.

SUMMARY OF THE INVENTION

Methods, apparatus, products, and heatsinks for detecting thermalinterface material TIM between a heat sink and an integrated circuit aredisclosed. The heat sink includes a plurality of TIM detection points,each TIM detection point adapted to receive TIM upon installation of theheat sink, each TIM detection point including a TIM detection deviceconfigured to be activated upon contact with TIM. Upon installation ofthe heat sink on the integrated circuit and the TIM, TIM is received inone or more of the TIM detection points; the TIM activates, in each ofthe one or more TIM detection points receiving the TIM, a TIM detectiondevice; and a TIM detection module determines, in dependence upon theactivations of the TIM detection devices, sufficiency of the TIM betweenthe heat sink and the integrated circuit.

The foregoing and other objects, features and advantages of theinvention will be apparent from the following more particulardescriptions of exemplary embodiments of the invention as illustrated inthe accompanying drawings wherein like reference numbers generallyrepresent like parts of exemplary embodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 sets forth a block diagram of a system for TIM between a heatsink and an integrated circuit according to embodiments of the presentinvention.

FIG. 2 sets forth a perspective view of an example system configured forTIM detection in accordance with embodiments of the present invention,prior to installation of a heat sink on an integrated circuit and TIM.

FIG. 3 sets forth a perspective view of the example system of FIG. 2,after installation of a heat sink on an integrated circuit and TIM.

FIG. 4 sets forth a perspective view of another example systemconfigured for TIM detection in accordance with embodiments of thepresent invention, prior to installation of a heat sink.

FIG. 5 sets forth a perspective view of the example system of FIG. 4,after installation of the heat sink.

FIG. 6 sets forth a perspective view of another example systemconfigured for TIM detection in accordance with embodiments of thepresent invention, prior to installation of a heat sink.

FIG. 7 sets forth a perspective view of the example system of FIG. 6,after installation of the heat sink.

FIG. 8 sets forth a block diagram of an example system for detecting TIMbetween a heat sink and integrated circuit in accordance withembodiments of the present invention, where the heat sink includes TIMdetection points configured to indicate a coverage area of TIM.

FIG. 9 sets forth a flow chart illustrating an exemplary method fordetecting TIM between a heat sink and an integrated circuit according toembodiments of the present invention.

FIG. 10A sets forth a perspective view of an example system configuredfor TIM detection in accordance with embodiments of the presentinvention, prior to installation of a heat sink on an integrated circuitand TIM, where the integrated circuit includes TIM detection points andTIM detection devices.

FIG. 10B sets forth a perspective view of the example system of FIG.10A, after installation of a heat sink on an integrated circuit and TIM.

FIG. 11 sets forth a perspective view of another example systemconfigured for TIM detection in accordance with embodiments of thepresent invention, prior to installation of a heat sink.

FIG. 12 sets forth a perspective view of the example system of FIG. 11,after installation of the heat sink.

FIG. 13 sets forth a perspective view of another example systemconfigured for TIM detection in accordance with embodiments of thepresent invention, prior to installation of a heat sink.

FIG. 14 sets forth a perspective view of the example system of FIG. 13,after installation of the heat sink.

FIG. 15 sets forth a flow chart illustrating an exemplary method fordetecting TIM between a heat sink and an integrated circuit according toembodiments of the present invention in which TIM detection points andTIM detection devices are implemented in an integrated circuit.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Exemplary methods, apparatus, and products for detecting thermalinterface material (‘TIM’) between a heat sink and an integrated circuitin accordance with the present invention are described with reference tothe accompanying drawings, beginning with FIG. 1. FIG. 1 sets forth ablock diagram of a system for detecting thermal interface material(‘TIM’) between a heat sink and an integrated circuit according toembodiments of the present invention. The system of FIG. 1 includesautomated computing machinery comprising an exemplary computer (152)useful in detecting TIM between a heat sink and an integrated circuitaccording to embodiments of the present invention. The computer (152) ofFIG. 1 includes at least one computer processor (156) or ‘CPU’ as wellas random access memory (168) (‘RAM’) which is connected through a highspeed memory bus (166) and bus adapter (158) to processor (156) and toother components of the computer (152).

The processor (156) is an example of an integrated circuit upon whichTIM (108) and a heat sink (102) may be installed. The example of FIG. 1sets forth two implementations configured to detect TIM between a heatsink and the processor (156). In one implementation the heat sink (102)is configured to detect TIM (108) between a heat sink and the processor(156). In another implementation, the processor (156) itself detects theTIM (108).

In the first implementation, the heat sink (102) includes a plurality ofTIM detection points (106). A TIM detection point as the term is usedhere is a receptacle adapted to receive TIM upon installation of theheat sink. When the heat sink (102) is installed on the TIM, the TIMseeps into the TIM detection points (106). Each TIM detection point(106) includes a TIM detection device configured to be activated uponcontact with TIM. That is, upon installation of the heat sink (102) onthe processor (156) and the TIM (108), one or more of the TIM detectionpoints receives the TIM.

The TIM (108) activates a TIM detection device (104) in each of the oneor more TIM detection points receiving the TIM (108). A TIM detectionmodule (112) determines, in dependence upon the activations of the TIMdetection devices (104), sufficiency of the TIM between the heat sinkand the integrated circuit. The TIM detection module (112) in theexample of FIG. 1 is depicted as a discrete component of the computer(152) coupled to the expansion bus (160) for clarity of explanation, notlimitation. Readers of skill in the art will recognize that such adevice may be implemented in a variety of ways including, for example,as a service processor, as an FPGA, and as other devices, coupled to theTIM detection devices (104) through an out-of-band bus. If the TIM isinsufficient, the TIM detection module (112) may notify a user (101).

In a second implementation, the processor (156) itself includes aplurality of TIM detection points (1006). In this implementation, likethe last, each TIM detection point (1006) is adapted to receive TIM uponinstallation of the heat sink (102). Each TIM detection point (1006)also includes a TIM detection device (1004) that is configured to beactivated upon contact with TIM. In this second example implementation,upon installation of the heat sink on the processor (156) and the TIM(108), TIM (108) is received in one or more of the TIM detection points(106). The TIM (108) activates, a TIM detection device (1004) in each ofthe one or more TIM detection points (1006) receiving the TIM (108).

A TIM detection module implemented as a module of computer programinstructions stored in RAM (168) determines in dependence upon theactivations of the TIM detection devices (1006), sufficiency of the TIMbetween the heat sink and the processor (156). Responsive to determiningthat the TIM (108) between the heat sink (102) and the processor (156)is insufficient, the TIM detection module (112) controls, in real-time,operation of the processor (156) to reduce heat generated by theprocessor (156). Although the TIM detection module (112) is depicted inthis example implementation as a module of computer program instructionsstored in RAM (168), readers of skill in the art will recognize thatsuch a module may also be implemented as hardware within the processor(156) itself, as a combination of hardware and software separate fromthe processor (156) and RAM (168), and in other ways.

In addition to the TIM detection module (112), an operating system (154)is also stored in RAM (168). Operating systems useful in systems thatdetect TIM between a heat sink and an integrated circuit according toembodiments of the present invention include UNIX™ Linux™ Microsoft XP™,AIX™ IBM's i5/OS™, and others as will occur to those of skill in theart. The operating system (154) and TIM detection module (112) in theexample of FIG. 1 are shown in RAM (168), but many components of suchsoftware typically are stored in non-volatile memory also, such as, forexample, on a disk drive (170).

The computer (152) of FIG. 1 includes disk drive adapter (172) coupledthrough expansion bus (160) and bus adapter (158) to processor (156) andother components of the computer (152). Disk drive adapter (172)connects non-volatile data storage to the computer (152) in the form ofdisk drive (170). Disk drive adapters useful in computers that detectTIM between a heat sink and an integrated circuit according toembodiments of the present invention include Integrated DriveElectronics (‘IDE’) adapters, Small Computer System Interface (‘SCSI’)adapters, and others as will occur to those of skill in the art.Non-volatile computer memory also may be implemented for as an opticaldisk drive, electrically erasable programmable read-only memory(so-called ‘EEPROM’ or ‘Flash’ memory), RAM drives, and so on, as willoccur to those of skill in the art.

The example computer (152) of FIG. 1 includes one or more input/output(‘I/O’) adapters (178). I/O adapters implement user-orientedinput/output through, for example, software drivers and computerhardware for controlling output to display devices such as computerdisplay screens, as well as user input from user (101) input devices(181) such as keyboards and mice. The example computer (152) of FIG. 1includes a video adapter (209), which is an example of an I/O adapterspecially designed for graphic output to a display device (180) such asa display screen or computer monitor. Video adapter (209) is connectedto processor (156) through a high speed video bus (164), bus adapter(158), and the front side bus (162), which is also a high speed bus.

The exemplary computer (152) of FIG. 1 includes a communications adapter(167) for data communications with other computers (182) and for datacommunications with a data communications network (100). Such datacommunications may be carried out serially through RS-232 connections,through external buses such as a Universal Serial Bus (‘USB’), throughdata communications networks such as IP data communications networks,and in other ways as will occur to those of skill in the art.Communications adapters implement the hardware level of datacommunications through which one computer sends data communications toanother computer, directly or through a data communications network.Examples of communications adapters useful in systems that detect TIMbetween a heat sink and an integrated circuit according to embodimentsof the present invention include modems for wired dial-upcommunications, Ethernet (IEEE 802.3) adapters for wired datacommunications, and 802.11 adapters for wireless data communications.

The arrangement of computers and other devices making up the exemplarysystem illustrated in FIG. 1 are for explanation, not for limitation.Data processing systems useful according to various embodiments of thepresent invention may include additional servers, routers, otherdevices, and peer-to-peer architectures, not shown in FIG. 1, as willoccur to those of skill in the art. Networks in such data processingsystems may support many data communications protocols, including forexample TCP (Transmission Control Protocol), IP (Internet Protocol),HTTP (HyperText Transfer Protocol), WAP (Wireless Access Protocol), HDTP(Handheld Device Transport Protocol), and others as will occur to thoseof skill in the art. Various embodiments of the present invention may beimplemented on a variety of hardware platforms in addition to thoseillustrated in FIG. 1.

For further explanation, FIG. 2 sets forth a perspective view of anexample system configured for TIM detection in accordance withembodiments of the present invention, prior to installation of a heatsink (102) on an integrated circuit (110) and TIM (108). The examplesystem of FIG. 2 includes a heat sink (102), an integrated circuit (110)installed on a printed circuit board (‘PCB’) (114), and TIM (108)applied to the integrated circuit (110). The example heat sink (102) ofFIG. 2 is adapted for TIM detection in accordance with embodiments ofthe present invention and includes a plurality of TIM detection points(106). Each TIM detection point (106) is adapted to receive TIM uponinstallation of the heat sink (102) on the integrated circuit (110) andthe TIM (108). Each TIM detection point (106) in the example heat sink(102) of FIG. 2 includes a TIM detection device (104) activated uponcontact with TIM (108) and providing a TIM detection signal (116) to aTIM detection module (112) upon activation for determination of thesufficiency of the TIM (108) between the heat sink and the integratedcircuit.

For further explanation, FIG. 3 sets forth a perspective view of theexample system of FIG. 2, after installation of a heat sink (102) on anintegrated circuit (110) and TIM (108). The example system of FIG. 3depicts the same system of FIG. 2, after installation of the heat sink.The TIM detection signals (116) of the heat sink couple to the TIMdetection module (112) upon installation. Also upon installation of theheat sink (102) in the example of FIG. 3, TIM (108) is received in anumber of the TIM detection points (106).

In each of the one or more TIM detection points (106) receiving the TIM,the TIM (108) activates a TIM detection device (104). Upon suchactivation, the TIM detection device (104) sends a TIM detection signal(116) to the TIM detection module (112). The TIM detection module (112)determines sufficiency of the TIM (108) between the heat sink (102) andthe integrated circuit (110).

TIM detection devices (104) may be implemented in a variety of ways. Forfurther explanation, therefore, FIG. 4 sets forth a perspective view ofanother example system configured for TIM detection in accordance withembodiments of the present invention, prior to installation of a heatsink. The system of FIG. 4 is similar to the system of FIG. 2 in thatthe system of FIG. 4 includes a heat sink (102), an integrated circuit(110) installed on a PCB (114), and TIM (108) applied to the integratedcircuit (110). The heat sink (102) includes a plurality of TIM detectionpoints (106), with each TIM detection point (106) including a TIMdetection device (104) activated upon contact with TIM (108) andproviding a TIM detection signal (116) to a TIM detection module (112)upon activation for determination of the sufficiency of the TIM (108)between the heat sink and the integrated circuit.

The example system of FIG. 4, however, differs from the system of FIG. 2in that in the example system of FIG. 4, a casing of the integratedcircuit is electrically coupled to a ground voltage and the TIM iselectrically conductive and is electrically coupled to the integratedcircuit casing. That is, the TIM is grounded through the integratedcircuit (110) and the PCB (114).

In the example system of FIG. 4, each TIM detection device (104)includes an electrical probe (402). The electrical probe (402) has asource voltage (Vss) prior to electrically coupling to the TIM (108).The TIM detection device (104) is activated upon contact with the TIM(108) by electrically coupling the electrical probe (402) to the TIM(108), the integrated circuit (110) casing, and the ground voltage.

For further explanation, FIG. 5 sets forth a perspective view of theexample system of FIG. 4, after installation of the heat sink. In theexample of FIG. 5, upon installation of the heat sink (102) on theintegrated circuit (110) and the TIM (108), TIM (108) is received in oneor more of the TIM detection points (106) and the TIM (108) activates aTIM detection device (104) in each of the TIM detection points receivingthe TIM (108). In the example of FIG. 5, activating a TIM detectiondevice (104) includes electrically coupling, by the TIM (108), theelectrical probe (402) to the integrated circuit (110) casing and theground voltage. By electrically coupling the electrical probe (402) tothe ground voltage, the voltage level at the electrical probe (402) isaltered from the source voltage (Vss) to the ground voltage.

The TIM detection module (112) determines sufficiency of the TIM betweenthe heat sink and the integrated circuit by detecting, for each TIMdetection point (104) receiving the TIM (108), the alteration of thevoltage level of each electrical probe. In this example a comparatorcompares the voltage at the electrical probe to a ground voltage. Whenthe electrical probe is at the source voltage (Vss) the comparatoroutputs a logic high signal (116). When the electrical probe is coupledto the ground voltage by the TIM (108), the comparator outputs a logiclow signal (116).

As mentioned above, TIM detection devices (104) may be implemented inother ways. For further explanation, therefore, FIG. 6 sets forth aperspective view of another example system configured for TIM detectionin accordance with embodiments of the present invention, prior toinstallation of a heat sink. The system of FIG. 6 is similar to thesystem of FIG. 2 in that the system of FIG. 6 includes a heat sink(102), an integrated circuit (110) installed on a PCB (114), and TIM(108) applied to the integrated circuit (110). The heat sink (102)includes a plurality of TIM detection points (106), with each TIMdetection point (106) including a TIM detection device (104) activatedupon contact with TIM (108) and providing a TIM detection signal (116)to a TIM detection module (112) upon activation for determination of thesufficiency of the TIM (108) between the heat sink and the integratedcircuit.

The system of FIG. 6 differs from the system of FIG. 2, however, in thatin the system of FIG. 6, each TIM detection device (104) includes amechanical switch (602). The mechanical switch is closed prior tocontact with the TIM (108). In the example of FIG. 6, the mechanicalswitch (602) is coupled to ground voltage when closed. The TIM detectiondevice is activated by physically opening, by the TIM (108), themechanical switch.

For further explanation, FIG. 7 sets forth a perspective view of theexample system of FIG. 6, after installation of the heat sink. In theexample of FIG. 7, upon installation of the heat sink (102) on theintegrated circuit (110) and the TIM (108), TIM (108) is received in oneor more of the TIM detection points (106) and the TIM (108) activates aTIM detection device (104) in each of the TIM detection points receivingthe TIM (108). In the example of FIG. 7, activating a TIM detectiondevice (104) includes physically opening the mechanical switch (602) bythe TIM (108). As mentioned above, the mechanical switch (602) iscoupled to ground voltage when closed. The voltage experienced on thesignal line (116) by the TIM detection module (112), therefore, prior tocontact between the TIM and the mechanical switch, is a ground voltage.After the TIM physically opens the mechanical switch (602, the voltageexperienced on the signal line (116) by the TIM detection module (112)is a source voltage (Vss). The alternation between a ground voltage andthe source voltage indicates to the TIM detection module (112) that TIMis present in the TIM detection point that includes the openedmechanical switch.

The TIM detection modules of the previous figures may be configured todetermine sufficiency of the TIM between the heat sink and theintegrated circuit in various ways. In one embodiment, a TIM detectionmodule may determine whether the number of activated TIM detectiondevices exceeds a predetermined threshold. In this embodiment, the TIMdetection module determines whether some minimum amount of TIM has beenapplied to the integrated circuit, regardless of the location of the TIMon the integrated circuit. In another embodiment, the TIM detectiondevice may, determine whether the positions of the activated TIMdetection devices indicate a sufficient coverage area of the TIM. Forfurther explanation, therefore, FIG. 8 sets forth a block diagram of anexample system for detecting TIM between a heat sink and integratedcircuit in accordance with embodiments of the present invention, wherethe heat sink includes TIM detection points configured to indicate acoverage area of TIM. The example system of FIG. 8 depicts a view of thebottom of a heat sink (102) configured with a plurality of TIM detectionpoints (106), with each TIM detection point adapted to receive TIM uponinstallation of the heat sink (102) and each TIM detection point (106)including a TIM detection device (104) configured to be activated uponcontact with TIM. In the example of FIG. 8, the heat sink (102) includessixteen TIM detection points (700-715), arranged in a grid. The TIMdetection points that are shaded (700-703, 706-707, 708, 712-713, and715) indicate an activated TIM detection device (104)—and thus,sufficient TIM at that physical location on the integrated circuit—andthose TIM detection points that are not shaded (704-705, 709-711, and714) indicate insufficient TIM at that physical location on theintegrated circuit.

More than half of the TIM detection devices are activated in the heatsink. In an implementation in which only a predefined number of TIMdetection devices need be activated to indicate sufficient TIM on theintegrated circuit, the TIM detection module (112) may determine thatthe TIM is sufficient. Given the physical layout of the non-activatedTIM detection devices (704-705, 709-711, and 714)—namely the center ofthe integrated circuit—the TIM may, in fact, be insufficient. In thisexample, the TIM detection module (112) utilizes not only the number ofactive TIM detection devices, but also the physical location of theactive (and non-active) TIM detection devices (104) to determine whetherthe positions of the activated TIM detection devices indicate asufficient coverage area of the TIM. If the TIM detection module (112)determines that the TIM is insufficient, the module (112) may notify theuser (101) of the insufficiency.

For further explanation, FIG. 9 sets forth a flow chart illustrating anexemplary method for detecting TIM between a heat sink and an integratedcircuit according to embodiments of the present invention. The examplemethod of FIG. 9 is carried out in a system similar to that depicted inthe examples of FIGS. 2 and 3 which includes a heat sink and anintegrated circuit, where the heat sink includes a plurality of TIMdetection points, each TIM detection point is adapted to receive TIMupon installation of the heat sink, and each TIM detection pointincludes a TIM detection device configured to be activated upon contactwith TIM.

The method of FIG. 9 includes receiving (902), upon installation of theheat sink on the integrated circuit and the TIM, TIM in one or more ofthe TIM detection points; activating (904), by the TIM in each of theone or more TIM detection points receiving the TIM, a TIM detectiondevice; and determining (906), by a TIM detection module in dependenceupon the activations of the TIM detection devices, sufficiency of theTIM between the heat sink and the integrated circuit.

If the TIM detection module determines that the TIM is sufficient, themethod of FIG. 9 continues by either notifying (910) a user of thesufficiency of the TIM or doing nothing. Responsive to determininginsufficiency of the TIM, the method of FIG. 9 continues by notifying(908), by the TIM detection module, a user of the insufficiency. The TIMdetection module may notify a user in a number of ways, by storing anindication in a log file, by sending a data communications message to apredefined target address, by activating a visual indication such as aLight Emitting Diode (‘LED’), and so on as will occur to readers ofskill in the art.

In the method of FIG. 9, determining (906) sufficiency of the TIMbetween the heat sink and the integrated circuit may be carried out bydetermining whether the number of activated TIM detection devicesexceeds a predetermined threshold, determining whether the positions ofthe activated TIM detection devices indicate a sufficient coverage areaof the TIM, or both.

In some embodiments, a casing of the integrated circuit is electricallycoupled to a ground voltage, the TIM is electrically conductive and iselectrically coupled to the integrated circuit casing, and each TIMdetection device includes an electrical probe, the electrical probehaving a source voltage prior to electrically coupling to the TIM. Insuch an embodiment, activating (904) the TIM detection device may becarried out by electrically coupling, by the TIM, the electrical probeto the integrated circuit casing and the ground voltage, altering thevoltage level at the electrical probe from the source voltage to theground voltage. Determining (906) sufficiency of the TIM between theheat sink and the integrated circuit in such an embodiment may becarried out by detecting, for each TIM detection point receiving theTIM, the alteration of the voltage level of each electrical probe.

In some embodiments, each TIM detection device includes a mechanicalswitch that is closed prior to receiving TIM. In such an embodiment,activating (904) the TIM detection device may be carried out byphysically opening, by the TIM, the mechanical switch. Determining (906)sufficiency of the TIM between the heat sink and the integrated circuitin such an embodiment may be carried out by detecting the opening ofeach mechanical switch activated upon receiving the TIM in the TIMdetection point.

FIGS. 2-9 describe an implementation in which TIM detection points andTIM detection devices are implemented in a heat sink. As explained abovewith respect to FIG. 1, such TIM detection points and TIM detectiondevices may also be implemented as part of an integrated circuit, suchas processor. For further explanation, therefore, FIG. 10A sets forth aperspective view of an example system configured for TIM detection inaccordance with embodiments of the present invention, prior toinstallation of a heat sink on an integrated circuit and TIM, where theintegrated circuit includes TIM detection points and TIM detectiondevices.

The example system of FIG. 10A includes a heat sink (1002), anintegrated circuit (1010) installed on a printed circuit board (‘PCB’)(1014), and TIM (1008) applied to the integrated circuit (1010). Theexample integrated circuit (1010) of FIG. 10A is adapted for TIMdetection in accordance with embodiments of the present invention andincludes a plurality of TIM detection points (1006). Each TIM detectionpoint (1006) is adapted to receive TIM upon installation of the heatsink (1002) on the integrated circuit (1010) and the TIM (1008). EachTIM detection point (1006) in the example integrated circuit (1002) ofFIG. 10A includes a TIM detection device (1004) activated upon contactwith TIM (1008) and providing a TIM detection signal to a TIM detectionmodule (1012) upon activation for determination of the sufficiency ofthe TIM (1008) between the heat sink and the integrated circuit.

For further explanation, FIG. 10B sets forth a perspective view of theexample system of FIG. 10A, after installation of a heat sink (1002) onan integrated circuit (1010) and TIM (1008). The example system of FIG.10B depicts the same system of FIG. 10A, after installation of the heatsink. Upon installation of the heat sink (1002) in the example of FIG.10B, TIM (1008) is received in a number of the TIM detection points(1006).

In each of the one or more TIM detection points (1006) receiving theTIM, the TIM (1008) activates a TIM detection device (1004). Upon suchactivation, the TIM detection device (1004) sends a TIM detection signalto the TIM detection module (1012) of the integrated circuit. The TIMdetection module (1012) determines sufficiency of the TIM (1008) betweenthe heat sink (1002) and the integrated circuit (1010). Responsive todetermining that the TIM between the heat sink and the integratedcircuit is insufficient, the TIM detection module (1012) controls, inreal-time, operation of the integrated circuit (1010) to reduce heatgenerated by the integrated circuit.

TIM detection devices (1004) may be implemented in an integrated circuit(1010) in a variety of ways. For further explanation, therefore, FIG. 11sets forth a perspective view of another example system configured forTIM detection in accordance with embodiments of the present invention,prior to installation of a heat sink. The system of FIG. 11 is similarto the system of FIG. 10A in that the system of FIG. 11 includes a heatsink (1002), an integrated circuit (1010) installed on a PCB (1014), andTIM (1008) applied to the integrated circuit (1010). The integratedcircuit (1002) includes a plurality of TIM detection points (1006), witheach TIM detection point (1006) including a TIM detection device (1004)activated upon contact with TIM (1008) and providing a TIM detectionsignal to a TIM detection module (1012) of the integrated circuit uponactivation for determination of the sufficiency of the TIM (1008)between the heat sink and the integrated circuit.

The example system of FIG. 11, however, differs from the system of FIG.10A in that in the example system of FIG. 11, a casing of the integratedcircuit (1010) is electrically coupled to a ground voltage and the TIM(1008) is electrically conductive and is electrically coupled to theintegrated circuit casing. That is, the TIM is grounded through theintegrated circuit (1010) and the PCB (1014).

In the example system of FIG. 11, each TIM detection device (1004)includes an electrical probe (1102). The electrical probe (1102) has asource voltage (Vss) prior to electrically coupling to the TIM (1008).The TIM detection device (1104) is activated upon contact with the TIM(1008) by electrically coupling the electrical probe (1102) to the TIM(1008), the integrated circuit (1010) casing, and the ground voltage.

For further explanation, FIG. 12 sets forth a perspective view of theexample system of FIG. 11, after installation of the heat sink. In theexample of FIG. 12, upon installation of the heat sink (1002) on theintegrated circuit (1010) and the TIM (1008), TIM (1008) is received inone or more of the TIM detection points (1006) and the TIM (1008)activates a TIM detection device (1004) in each of the TIM detectionpoints receiving the TIM (1008). In the example of FIG. 12, activating aTIM detection device (1004) includes electrically coupling, by the TIM(1008), the electrical probe (1102) to the integrated circuit (1010)casing and the ground voltage. By electrically coupling the electricalprobe (1102) to the ground voltage, the voltage level at the electricalprobe (1102) is altered from the source voltage (Vss) to the groundvoltage.

The TIM detection module (1012) determines sufficiency of the TIMbetween the heat sink and the integrated circuit by detecting, for eachTIM detection point (1004) receiving the TIM (1008), the alteration ofthe voltage level of each electrical probe. In this example a comparatorcompares the voltage at the electrical probe to a ground voltage. Whenthe electrical probe is at the source voltage (Vss) the comparatoroutputs a logic high signal to the TIM detection module (1012). When theelectrical probe is coupled to the ground voltage by the TIM (1008), thecomparator outputs a logic low signal (1016).

TIM detection devices (1004) may be implemented in integrated circuits(1010) in other ways as well. For further explanation, therefore, FIG.13 sets forth a perspective view of another example system configuredfor TIM detection in accordance with embodiments of the presentinvention, prior to installation of a heat sink. The system of FIG. 13is similar to the system of FIG. 10A in that the system of FIG. 13includes a heat sink (1002), an integrated circuit (1010) installed on aPCB (1014), and TIM (1008) applied to the integrated circuit (1010). Theintegrated circuit (1010) includes a plurality of TIM detection points(1006), with each TIM detection point (1006) including a TIM detectiondevice (1004) activated upon contact with TIM (1008) and providing a TIMdetection signal (1016) to a TIM detection module (1012) upon activationfor determination of the sufficiency of the TIM (1008) between the heatsink and the integrated circuit.

The system of FIG. 13 differs from the system of FIG. 10A, however, inthat in the system of FIG. 13, each TIM detection device (1004) includesa mechanical switch (1202). The mechanical switch is closed prior tocontact with the TIM (108). In the example of FIG. 13, the mechanicalswitch (602) is coupled to ground voltage when closed. The TIM detectiondevice is activated by physically opening, by the TIM (1008), themechanical switch.

For further explanation, FIG. 14 sets forth a perspective view of theexample system of FIG. 13, after installation of the heat sink. In theexample of FIG. 14, upon installation of the heat sink (1002) on theintegrated circuit (1010) and the TIM (1008), TIM (1008) is received inone or more of the TIM detection points (1006) and the TIM (1008)activates a TIM detection device (1004) in each of the TIM detectionpoints receiving the TIM (1008). In the example of FIG. 14, activating aTIM detection device (1004) includes physically opening the mechanicalswitch (1302) by the TIM (1008). As mentioned above, the mechanicalswitch (1302) is coupled to ground voltage when closed. The voltageexperienced by the TIM detection module (1012) from the TIM detectiondevice (1004), therefore, prior to contact between the TIM and themechanical switch, is a ground voltage. After the TIM physically opensthe mechanical switch (1302), the voltage experienced on the signal line(1016) by the TIM detection module (1012) is a source voltage (Vss). Thealternation between a ground voltage and the source voltage indicates tothe TIM detection module (1012) that TIM is present in the TIM detectionpoint that includes the opened mechanical switch.

For further explanation, FIG. 15 sets forth a flow chart illustrating anexemplary method for detecting TIM between a heat sink and an integratedcircuit according to embodiments of the present invention in which TIMdetection points and TIM detection devices are implemented in anintegrated circuit. The example method of FIG. 15 is carried out in asystem similar to that depicted in the examples of FIGS. 10A and 10Bwhich includes a heat sink and an integrated circuit, where theintegrated circuit includes a plurality of TIM detection points, eachTIM detection point is adapted to receive TIM upon installation of theheat sink, and each TIM detection point includes a TIM detection deviceconfigured to be activated upon contact with TIM.

The method of FIG. 9 includes receiving (1502), upon installation of theheat sink on the integrated circuit and the TIM, TIM in one or more ofthe TIM detection points; activating (1504), by the TIM in each of theone or more TIM detection points receiving the TIM, a TIM detectiondevice; and determining (1506), by a TIM detection module of theintegrated circuit in dependence upon the activations of the TIMdetection devices, sufficiency of the TIM between the heat sink and theintegrated circuit.

If the TIM detection module determines that the TIM is sufficient, themethod of FIG. 15 continues by either notifying (1510) a user of thesufficiency of the TIM or operating (1512) the integrated circuitnormally. Responsive to determining insufficiency of the TIM, bycontrast, the method of FIG. 15 continues by controlling (1508), inreal-time by the TIM detection module, operation of the integratedcircuit to reduce heat generated by the integrated circuit.

In some embodiments, the integrated circuit may be implemented as acomputer processor. In such embodiments, controlling (1508) operation ofthe integrated circuit in real-time to reduce heat generated by theintegrated circuit may be carried out by throttling the computerprocessor.

In some embodiments, the integrated circuit is implemented as a computerprocessor, the computer processor including a number of functionalunits, a number of cache memory devices, and a number of registers. Insuch an embodiment controlling (1508) operation of the integratedcircuit in real-time to reduce heat generated by the integrated circuitmay be carried out by dispatching instructions among functional units,utilizing cache memory devices, and utilizing registers so as to avoidcomponents of the computer processor having physical locations withinsufficient TIM.

In some embodiments, the integrated circuit is implemented as amulti-core computer processor. In such an embodiment, controlling (1508)operation of the integrated circuit in real-time to reduce heatgenerated by the integrated circuit may be carried out by distributingexecution of computer program instructions among the cores of thecomputer processor so as to avoid cores having a physical location withinsufficient TIM.

As will be appreciated by one skilled in the art, aspects of the presentinvention may be embodied as a system, method or computer programproduct. Accordingly, aspects of the present invention may take the formof an entirely hardware embodiment, an entirely software embodiment(including firmware, resident software, micro-code, etc.) or anembodiment combining software and hardware aspects that may allgenerally be referred to herein as a “circuit,” “module” or “system.”Furthermore, aspects of the present invention may take the form of acomputer program product embodied in one or more computer readablemedium(s) having computer readable program code embodied thereon.

Any combination of one or more computer readable medium(s) may beutilized. The computer readable medium may be a computer readable signalmedium or a computer readable storage medium. A computer readablestorage medium may be, for example, but not limited to, an electronic,magnetic, optical, electromagnetic, infrared, or semiconductor system,apparatus, or device, or any suitable combination of the foregoing. Morespecific examples (a non-exhaustive list) of the computer readablestorage medium would include the following: an electrical connectionhaving one or more wires, a portable computer diskette, a hard disk, arandom access memory (RAM), a read-only memory (ROM), an erasableprogrammable read-only memory (EPROM or Flash memory), an optical fiber,a portable compact disc read-only memory (CD-ROM), an optical storagedevice, a magnetic storage device, or any suitable combination of theforegoing. In the context of this document, a computer readable storagemedium may be any tangible medium that can contain, or store a programfor use by or in connection with an instruction execution system,apparatus, or device.

A computer readable signal medium may include a propagated data signalwith computer readable program code embodied therein, for example, inbaseband or as part of a carrier wave. Such a propagated signal may takeany of a variety of forms, including, but not limited to,electro-magnetic, optical, or any suitable combination thereof. Acomputer readable signal medium may be any computer readable medium thatis not a computer readable storage medium and that can communicate,propagate, or transport a program for use by or in connection with aninstruction execution system, apparatus, or device.

Program code embodied on a computer readable medium may be transmittedusing any appropriate medium, including but not limited to wireless,wireline, optical fiber cable, RF, etc., or any suitable combination ofthe foregoing.

Computer program code for carrying out operations for aspects of thepresent invention may be written in any combination of one or moreprogramming languages, including an object oriented programming languagesuch as Java, Smalltalk, C++ or the like and conventional proceduralprogramming languages, such as the “C” programming language or similarprogramming languages. The program code may execute entirely on theuser's computer, partly on the user's computer, as a stand-alonesoftware package, partly on the user's computer and partly on a remotecomputer or entirely on the remote computer or server. In the latterscenario, the remote computer may be connected to the user's computerthrough any type of network, including a local area network (LAN) or awide area network (WAN), or the connection may be made to an externalcomputer (for example, through the Internet using an Internet ServiceProvider).

Aspects of the present invention are described above with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems) and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer program instructions. These computer program instructions maybe provided to a processor of a general purpose computer, specialpurpose computer, or other programmable data processing apparatus toproduce a machine, such that the instructions, which execute via theprocessor of the computer or other programmable data processingapparatus, create means for implementing the functions/acts specified inthe flowchart and/or block diagram block or blocks.

These computer program instructions may also be stored in a computerreadable medium that can direct a computer, other programmable dataprocessing apparatus, or other devices to function in a particularmanner, such that the instructions stored in the computer readablemedium produce an article of manufacture including instructions whichimplement the function/act specified in the flowchart and/or blockdiagram block or blocks.

The computer program instructions may also be loaded onto a computer,other programmable data processing apparatus, or other devices to causea series of operational steps to be performed on the computer, otherprogrammable apparatus or other devices to produce a computerimplemented process such that the instructions which execute on thecomputer or other programmable apparatus provide processes forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof code, which comprises one or more executable instructions forimplementing the specified logical function(s). It should also be notedthat, in some alternative implementations, the functions noted in theblock may occur out of the order noted in the figures. For example, twoblocks shown in succession may, in fact, be executed substantiallyconcurrently, or the blocks may sometimes be executed in the reverseorder, depending upon the functionality involved. It will also be notedthat each block of the block diagrams and/or flowchart illustration, andcombinations of blocks in the block diagrams and/or flowchartillustration, can be implemented by special purpose hardware-basedsystems that perform the specified functions or acts, or combinations ofspecial purpose hardware and computer instructions.

It will be understood from the foregoing description that modificationsand changes may be made in various embodiments of the present inventionwithout departing from its true spirit. The descriptions in thisspecification are for purposes of illustration only and are not to beconstrued in a limiting sense. The scope of the present invention islimited only by the language of the following claims.

What is claimed is:
 1. A method of detecting thermal interface material(‘TIM’) between a heat sink and an integrated circuit, the heat sinkcomprising a plurality of TIM detection points, each TIM detection pointadapted to receive TIM upon installation of the heat sink, each TIMdetection point including a TIM detection device configured to beactivated upon contact with TIM, the method comprising: receiving, uponinstallation of the heat sink on the integrated circuit and the TIM, TIMin one or more of the TIM detection points; activating, by the TIM ineach of the one or more TIM detection points receiving the TIM, a TIMdetection device; and determining, by a TIM detection module independence upon the activations of the TIM detection devices,sufficiency of the TIM between the heat sink and the integrated circuit.2. The method of claim 1 further comprising: responsive to determininginsufficiency of the TIM, notifying, by the TIM detection module, a userof the insufficiency.
 3. The method of claim 1 wherein determiningsufficiency of the TIM between the heat sink and the integrated circuitfurther comprises determining whether the number of activated TIMdetection devices exceeds a predetermined threshold.
 4. The method ofclaim 1 wherein determining sufficiency of the TIM between the heat sinkand the integrated circuit further comprises determining whether thepositions of the activated TIM detection devices indicate a sufficientcoverage area of the TIM.
 5. The method of claim 1 wherein: a casing ofthe integrated circuit is electrically coupled to a ground voltage; theTIM is electrically conductive and is electrically coupled to theintegrated circuit casing; each TIM detection device comprises anelectrical probe, the electrical probe having a source voltage prior toelectrically coupling to the TIM; and activating the TIM detectiondevice further comprises electrically coupling, by the TIM, theelectrical probe to the integrated circuit casing and the groundvoltage, altering the voltage level at the electrical probe from thesource voltage to the ground voltage; and determining sufficiency of theTIM between the heat sink and the integrated circuit further comprisesdetecting, for each TIM detection point receiving the TIM, thealteration of the voltage level of each electrical probe.
 6. The methodof claim 1 wherein: each TIM detection device comprises a mechanicalswitch, the mechanical switch closed prior to receiving TIM; andactivating the TIM detection device further comprises physicallyopening, by the TIM, the mechanical switch; and determining sufficiencyof the TIM between the heat sink and the integrated circuit furthercomprises detecting the opening of each mechanical switch activated uponreceiving the TIM in the TIM detection point.
 7. An apparatus fordetecting thermal interface material (‘TIM’) between a heat sink and anintegrated circuit, the heat sink comprising a plurality of TIMdetection points, each TIM detection point adapted to receive TIM uponinstallation of the heat sink, each TIM detection point including a TIMdetection device configured to be activated upon contact with TIM,wherein: upon installation of the heat sink on the integrated circuitand the TIM, one or more of the TIM detection points receives TIM; theTIM in each of the one or more TIM detection points receiving the TIM,activates the TIM detection device; and the apparatus further comprisesa computer processor, a computer memory operatively coupled to thecomputer processor, the computer memory having disposed within itcomputer program instructions that, when executed by the computerprocessor, cause the apparatus to carry out the step of: determining, bya TIM detection module in dependence upon the activations of the TIMdetection devices, sufficiency of the TIM between the heat sink and theintegrated circuit.
 8. The apparatus of claim 7 further comprisingcomputer program instructions that, when executed, cause the apparatusto carry out the steps of: responsive to determining insufficiency ofthe TIM, notifying, by the TIM detection module, a user of theinsufficiency.
 9. The apparatus of claim 7 wherein determiningsufficiency of the TIM between the heat sink and the integrated circuitfurther comprises determining whether the number of activated TIMdetection devices exceeds a predetermined threshold.
 10. The apparatusof claim 7 wherein determining sufficiency of the TIM between the heatsink and the integrated circuit further comprises determining whetherthe positions of the activated TIM detection devices indicate asufficient coverage area of the TIM.
 11. The apparatus of claim 7wherein: a casing of the integrated circuit is electrically coupled to aground voltage; the TIM is electrically conductive and is electricallycoupled to the integrated circuit casing; each TIM detection devicecomprises an electrical probe, the electrical probe having a sourcevoltage prior to electrically coupling to the TIM; and activating theTIM detection device further comprises electrically coupling, by theTIM, the electrical probe to the integrated circuit casing and theground voltage, altering the voltage level at the electrical probe fromthe source voltage to the ground voltage; and determining sufficiency ofthe TIM between the heat sink and the integrated circuit furthercomprises detecting, for each TIM detection point receiving the TIM, thealteration of the voltage level of each electrical probe.
 12. Theapparatus of claim 7 wherein: each TIM detection device comprises amechanical switch, the mechanical switch closed prior to receiving TIM;and activating the TIM detection device further comprises physicallyopening, by the TIM, the mechanical switch; and determining sufficiencyof the TIM between the heat sink and the integrated circuit furthercomprises detecting the opening of each mechanical switch activated uponreceiving the TIM in the TIM detection point.
 13. A computer programproduct for detecting thermal interface material (‘TIM’) between a heatsink and an integrated circuit, the heat sink comprising a plurality ofTIM detection points, each TIM detection point adapted to receive TIMupon installation of the heat sink, each TIM detection point including aTIM detection device configured to be activated upon contact with TIM,the computer program product disposed upon a computer readable medium,the computer program product comprising computer program instructionsthat, when executed, cause a computer to carry out the steps of:receiving, upon installation of the heat sink on the integrated circuitand the TIM, TIM in one or more of the TIM detection points; activating,by the TIM in each of the one or more TIM detection points receiving theTIM, a TIM detection device; and determining, by a TIM detection modulein dependence upon the activations of the TIM detection devices,sufficiency of the TIM between the heat sink and the integrated circuit.14. The computer program product of claim 13 wherein determiningsufficiency of the TIM between the heat sink and the integrated circuitfurther comprises determining whether the number of activated TIMdetection devices exceeds a predetermined threshold.
 15. The computerprogram product of claim 13 wherein determining sufficiency of the TIMbetween the heat sink and the integrated circuit further comprisesdetermining whether the positions of the activated TIM detection devicesindicate a sufficient coverage area of the TIM.
 16. The computer programproduct of claim 13 wherein: a casing of the integrated circuit iselectrically coupled to a ground voltage; the TIM is electricallyconductive and is electrically coupled to the integrated circuit casing;each TIM detection device comprises an electrical probe, the electricalprobe having a source voltage prior to electrically coupling to the TIM;and activating the TIM detection device further comprises electricallycoupling, by the TIM, the electrical probe to the integrated circuitcasing and the ground voltage, altering the voltage level at theelectrical probe from the source voltage to the ground voltage; anddetermining sufficiency of the TIM between the heat sink and theintegrated circuit further comprises detecting, for each TIM detectionpoint receiving the TIM, the alteration of the voltage level of eachelectrical probe.
 17. The computer program product of claim 13 wherein:each TIM detection device comprises a mechanical switch, the mechanicalswitch closed prior to receiving TIM; and activating the TIM detectiondevice further comprises physically opening, by the TIM, the mechanicalswitch; and determining sufficiency of the TIM between the heat sink andthe integrated circuit further comprises detecting the opening of eachmechanical switch activated upon receiving the TIM in the TIM detectionpoint.
 18. A heat sink configured for thermal interface material (‘TIM’)detection, the heat sink comprising: a plurality of TIM detectionpoints, each TIM detection point adapted to receive TIM uponinstallation of the heat sink on an integrated circuit and the TIM;wherein each TIM detection point comprises a TIM detection deviceactivated upon contact with TIM and providing TIM detection signals to aTIM detection module upon activation for determination of thesufficiency of the TIM between the heat sink and the integrated circuit.19. The heat sink of claim 18 wherein: a casing of the integratedcircuit is electrically coupled to a ground voltage; the TIM iselectrically conductive and is electrically coupled to the integratedcircuit casing; each TIM detection device comprises an electrical probe,the electrical probe having a source voltage prior to electricallycoupling to the TIM; and the TIM detection device is activated uponcontact with the TIM by electrically coupling the electrical probe tothe TIM, integrated circuit casing, and the ground voltage, altering thevoltage level at the electrical probe from the source voltage to theground voltage.
 20. The heat sink of claim 18 wherein: each TIMdetection device comprises a mechanical switch, the mechanical switchclosed prior to receiving TIM; and the TIM detection device is activatedby physically opening, by the TIM, the mechanical switch.